This process consists of putting metallic coating (Nickel, Copper, gold) on a substrate on which the shape of the parts required, has been created by photographic means. When the desired thickness has been achieved, the part is removed from the substrate.
By this way WIPELEC produces parts with very low thickness or with very thin apertures (5 µm).
Ability to produce apertures smaller than the thickness of the material
Homogenous metallic structure
Checked thickness from 4 to 200 µm
No breaking egdes
No sharp edges